Contact us

If you would like to complete and submit an application online for EMC Certification, click here.

Or, to access a certification application that you can print and submit via fax or mail, click here*.

(* Note: This document is in the Adobe Acrobat Portable Document Format [PDF]. Before viewing it, you may need to download the Adobe Acrobat Reader. The free Adobe® Acrobat® Reader allows you to view, navigate and print PDF files across all major computing platforms.)

For more information about the International "emc-Mark," please contact any one of the following certification organizations:

Italian Quality Mark Institute (IMQ)

TÜV Product Service GmbH (TÜV PS)

Underwriters Laboratories Inc. (UL)

VDE Testing and Certification Institute(VDE)

Please let us know if you have comments or feedback on the design or content of this site.

Italian Quality Mark Institute (IMQ)

E-mail: info@imq.it

Location: Italy

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TÜV Product Service GmbH

Contact TÜV: http://www.tuvglobal.com/contact.htm or mailto:germany@babtps.com

Locations: China, Denmark, France, Germany, Greece, Hong Kong, India, Italy, Japan, Korea, Netherlands, Philippines, Singapore, Slovakia, Spain, Taiwan, United Kingdom, USA

For TÜV office addresses and contacts, click here.

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Underwriters Laboratories Inc. (UL)

Contact UL: https://www.ul.com/emc/emccont.cfm

Locations: Argentina, Brazil, Canada, Chile, China, Denmark, France, Germany, Hong Kong, India, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Norway, Poland, Singapore, Spain, Sweden, Switzerland, Taiwan, Thailand, United Kingdom, United States* (Alaska, California, Colorado, Florida, Georgia, Illinois*, Indiana, Maryland, Massachusetts, Michigan, Minnesota, Missouri, Nevada, New York, North Carolina, Texas, Washington, D.C., Washington State)

* Corporate Headquarters

For UL office addresses and contacts, click here.

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VDE Testing and Certification Institute

E-mail: Stephan.Kloska@vde.com

Location:Germany*, Hong-Kong, Taiwan, Korea, Japan

* Corporate Headquarters

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This page last revised: 9/2/04